1215MGF

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CMOS Technology Advantage
 
  • Choice of various scintillator
    • Provide resolution requirements based on work condition
  • Provide optimized Sensitivity
    • Radiation hard pixel design with adjustable saturation dose levels
    • Suitable for all industrial applications
  • Clear image with high-resolution and low noise performance
 
More precise details even
at Smallest components
  • More precise NDT inspections for even the smallest components
  • Industrial X-ray is ideal for
    • Solder inspection, Electronics inspection, Battery inspection Ball Grid Array inspection, Through Hole Technology inspection
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Excellent High-Resolution
by CMOS Technology
  • Standard models in a range of pixel and detector sizes
  • Robust mechanical design
Application
Specification
Sensor Type

CMOS

Scintillator

GOS

Total Pixel Matrix (Pixels)

2352 x 2944 (@1x1)
1176 x 1472 (@2x2)

Active Area (mm)

116.4 x 145.7

Pixel Pitch (㎛)

49.5 (@1x1)
99 (@2x2)

Frame Rate (fps)

10 (@1x1)
35 (@2x2)

Energy Range (kVp)

40 ~ 130

Power Consumption

24 V / 3.54 A

A/D Conversion (bits)

14

Data Interface

C-link

Dimension (mm)

240.2 x 160.0 x 33.1

Weight (kg)

2.7

  • Product design and specifications are subject to change without prior notice to improve product performance.
  • Downloads are only supported for customers who have filled out information.
  • The image quality level may vary depending on the product usage environment.

  • Averaging : Remove the noise of image
  • Blending : Confirming the difference between levels
  • Line profile : Available to Image validation based on ASTM Standard.
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