1215FCB·FGB

High-Sensitivity Dynamic
Detector Optimized AXI
  • X-ray inspection of all visible and hidden solder joints
  • New detector option for high resolution X-ray inspection of electronic assemblies
  • Flexible use for 2D and 3D inspection
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High Class Image Quality for AXI
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 High Resolution Type
  • Superior Pixel Resolution new detectors more competent to semiconductors and tiny electronics components inspection
  • Advanced evaluation without overlaying features in the X-ray image
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 High Speed Type
  • More than 2X faster than conventional
  • Stay the sensitivity without data loss even at high speed
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 Premium Solution Type
  • Premium Dynamic Detector of High-resolution, High-Speed, High-Sensitivity, High-Energy
  • High-resolution even at a high output : up to 320kVp
 
Excellent High-Resolution
by CMOS Technology
  • Standard models in a range of pixel and detector sizes
  • Robust mechanical design
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Application
Specification
Sensor Type

CMOS

Scintillator

CsI / GOS

Total Pixel Matrix (Pixels)

2352 x 2944 (@1x1)
1176 x 1472 (@2x2)

Active Area (mm)

116.4 x 145.7

Pixel Pitch (㎛)

49.5 (@1x1)
99 (@2x2)

Frame Rate (fps)

8 /10 (@1x1)
35 / 37 (@2x2)
*GigE / C-link

Energy Range (kVp)

40 - 160 (Normal)
40 - 320 (High energy option)

Power Consumption

24 V / 3.54 A

A/D Conversion (bits)

14

Data Interface

GigE / C-link

Dimension (mm)

240.2 x 160.0 x 33.1

Weight (kg)

2.7

  • Product design and specifications are subject to change without prior notice to improve product performance.
  • Downloads are only supported for customers who have filled out information.
  • The image quality level may vary depending on the product usage environment.
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