2020DCA·DGA

0909 inch

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Examining various item available
  • Specialized for Die-casting
  • Suitable for Equipment system
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Designed for high resolution by CMOS technology
  • High contrast & Less noise
  • High resolution with no lag
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Innovative solution by special size & design
  • Large active area
  • High energy range, up to 320 kVp(High resolution option)
Specification
Sensor Type

CMOS

Scintillator

CsI / GOS

Total Pixel Matrix (Pixels)

1120 X 1120 (@1x1)
560 X 560 (@2x2)

Active Area (mm)

201.6 X 201.6

Pixel Pitch (㎛)

180 (@1x1)
360 (@2x2)

Frame Rate (fps)

30 (@1x1)
75 (@2x2)

Energy Range (kVp)

40~225(Normal)
~320(High resolution)

Power Consumption

Typ. 11.5

A/D Conversion (bits)

14 / 16

Data Interface

GigE / C-link

Dimension (mm)

245 X 245 X 55

Weight (kg)

3.2

  • Product design and specifications are subject to change without prior notice to improve product performance.
  • Downloads are only supported for customers who have filled out information.
  • The image quality level may vary depending on the product usage environment.

  • Averaging : Remove the noise of image
  • Blending : Confirming the difference between levels
  • Line profile : Available to Image validation based on ASTM Standard.
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